Tokyo Electron

Wafer Bonder/Debonder Synapse™ Series | Products and Service(products) | Tokyo Electron Ltd.

Synapse™ series became an industry standard Bonding/DeBonding tools for 300mm wafers, by combining TEL’s leading-edge technologies such as ultra-thin wafer transfer, chemical coating, plasma processing and cleaning developed over the 50 years of history. Synapse™ series provide advanced solutions for temporary Bonding/DeBonding process in TSV (Through Silicon Via), permanent bonding process for CMOS image sensor and other various types of devices to contribute to high volume manufacturing of 3D integration which becomes even more important and expected to grow.

Wafer Edge Trimming Ulucus™ Series | Products and Service(products) | Tokyo Electron Ltd.

The Ulucus™ series of semiconductor production equipment integrates TEL’s market-leading and production-proven Coater/Developer platform technology with several advanced technologies including wafer cleaning. As further semiconductor scaling and performance enhancements are crucial to such devices as CMOS image sensors, next-generation memories, and advanced logic chips, chip manufacturers are increasingly adopting 3D high-density packaging technologies using permanent wafer bonding methods. TEL anticipates a significant growth in permanent wafer bonding processes, and has introduced high-volume processing systems equipped with innovative technologies to address the customers’ production needs.